fabrication for electroplating thick metal pads

ABSTRACT

A method of electroplating includes forming a seed region to be electroplated on a first portion of a substrate, forming a ground plane on a second portion of a substrate, electrically isolating the ground plane from the seed region, electroplating the region, wherein electroplating includes causing the ground plane and the region to make electrical connection, and then removing the ground plane region on the second portion of the substrate, but not removing the electrical isolation. This creates a structure having a substrate, a passivation layer on the substrate, and at least one electroplated, metal region on the substrate such that there is contiguous contact between the metal region and the passivation layer. And, after an additional flip-chip assembly to a bond pad/heat sinking chip, results in a device having a bond pad chip having bond pads, solder beads formed on the bond pads, and a component connected to the bond pads by the solder beads. Wherein, the component has a substrate, a passivation layer on the substrate, and at least one electroplated, metal region on the substrate such that there is contiguous contact between the metal region and the passivation layer.

This is a Divisional of co-pending U.S. patent application Ser. No.11/614,267, filed Dec. 21, 2006, entitled FABRICATION FOR ELECTROPLATINGTHICK METAL PADS, the disclosure of which is herein incorporated byreferenced in its entirety.

BACKGROUND

Packaging of ultraviolet (UV) transmitters, such as Light EmittingDiodes (LEDs), generally involves ‘flip-chip’ bonding the LED to anotherchip to allow light extraction through the underlying substrate.Typically, flip-chip bonding is one type of mounting used forsemiconductor devices, such as IC chips, to mount chips together or in apackage. In this process solder beads are deposited on one of the chip'selectrical pads, and then the individual LED die, or ideally the entirewafer of LED die, is mounted upside down on the package, or receivingchip. This leaves the LED chip's electrical connections facing down ontothe package, while the back side of the die faces up.

Issues arise in the packaging and mounting processes of LEDs with regardto properly heat sinking the LED region for heat management, as well asmaking isolated but robust connections to the p and n contacts of theLED. Depositing thick metal over the p and n contacts, on the order ofmicrometers (microns), and an electrical passivation layer between themhelps alleviate both of these problems. The thick metal pad acts as aheat sink, while ensuring that the contacts to the isolated p and nregions make the necessary electrical connections. The electricalpassivation layer is essential to preventing the two contacts fromshorting together during the bonding process.

Electroplating generally forms the thick metal pads. During the typicalelectroplating process for the thick metal pads, extra effort ensuresthat the ground plane layer has electrical contact with theelectroplating seed layer. The extra effort generally involves aphotolithography step with an additional mask layer, over etching of apassivation layer, or a deliberate misalignment during aphotolithography process.

Each extra step adds complexity and cost to the manufacturing processthat in turn affects the cost of the resulting chip or chips. Removal ofany of the processes within the manufacturing process would lower thecomplexity and decrease the cost of manufacturing the resulting packagedLEDs on the chips.

SUMMARY

Embodiments include a method of electroplating. The method includesforming a seed region to be electroplated on a first portion of asubstrate, forming a ground plane on a second portion of a substrate,electrically isolating the ground plane from the region, andelectroplating on the seed region, wherein electroplating includescausing the ground plane and the seed region to make electricalconnection. The remaining ground plane regions are then removedisolating the electrical connects from one another.

Other embodiments include a structure having a substrate, a passivationlayer on the substrate, and at least one electroplated, metal region onthe substrate such that there is contiguous contact between the metalregion and the passivation layer.

Other embodiments include a device having a bond pad chip having bondpads, solder beads formed on the bond pads, and a component connected tothe bond pads by the solder beads. The component has a substrate, apassivation layer on the substrate, and at least one electroplated,metal region on the substrate such that there is contiguous contactbetween the metal region and the passivation layer.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of the invention may be best understood by reading thedisclosure with reference to the drawings, wherein:

FIG. 1 shows a typical LED structure as an example of a structuresuitable for electroplating at the beginning of the electroplatingprocess.

FIG. 2 shows an LED structure with a silicon nitride passivation layer.

FIG. 3 shows a titanium ground plane on the passivation layer.

FIG. 4 shows an LED structure after a photolithographic patterning andetching process.

FIG. 5 shows an initial, lateral metal bead formation from a groundplane.

FIG. 6 shows an example of a structure at the end of an electroplatingprocess.

FIG. 7 shows an example of a structure after removal of photoresist anda ground plane.

FIG. 8 shows an example of an electroplated structure being flip-chipbonded to a bond pad chip for packaging.

DETAILED DESCRIPTION OF THE EMBODIMENTS

FIG. 1 shows a structure suitable for electroplating. This particularstructure is a light-emitting diode (LED), but any structure suitablefor electroplating may undergo the processes described here. The exampleof an LED merely provides a basis for discussion, and no limitation tothe particular structure is intended or should be inferred. Thetechniques disclosed here may also apply to many electronic,opto-electronic, microelectromechanical components that may benefit fromelectroplating such as improved structural stability, enhanced heatsinking, lower electrical resistance, added mass to the chip, etc.

In the following discussion, the manufacturing process employs severaldifferent processes and procedures for ease of discussion with theunderstanding that any process may be replaced with any other process ofa similar nature. For example, the discussion below discloses wetetching with the understanding that it is an example of material removalprocess and any suitable material removal process may occur in place ofwet etching.

FIG. 1 shows an LED that already has its active region 12 formed on thesubstrate 10. The substrate 10 may be sapphire or other transparentsubstance that allows transmission of light when the LEDs are flip-chipbonded, or mounted ‘upside down.’ The substrate 10 may have a mesa 16 toallow the n-contact and p-contact regions to allow electricallyconnections to occur on approximately the same plane during flip-chipbonding.

Initially, a series of aluminum-gallium-nitrogen (AlGaN) layers areepitaxially grown on a suitable substrate, typically sapphire, thatcomprises the LED active layers. The LED active region then receives acoating of p-contact metal, such as nickel/gold (Ni/Au) 14. This processmay also use other materials. The process may consist of evaporating thep-contact metal onto the LED chip, and then performing photolithographicpatterning to define the regions of the p-contact metal as an example ofa patterning process. The unwanted portion of the p-contact metal maythen be removed in a wet etch, or other removal process, and then thealuminum-gallium-nitrogen (AlGaN) is in turned etched using the samephotolithographic patterning, by chemically assisted ion beam etching(CAIBE) for example.

The n-contact metal, layer 18, may then be evaporated or otherwisedeposited, portions defined, such as by photolithography, and selectedportions removed. The resulting structure may then undergo testing,prior to beginning the electroplating process. FIG. 1 shows thisresulting structure. The electroplating process, as that term is usedhere, refers to the processing that occurs after the structure suitablefor electroplating with a suitable seed layer exists. In thisdiscussion, the remaining processes are part of the electroplatingprocess.

In FIG. 2, an isolation layer 20 is deposited, such as silicon nitride(SiN). This isolation layer may also be referred to as a passivationlayer. In one embodiment, the passivation material is etch-resistant, asin the case of SiN. Etch-resistant, as that term is used here, means amaterial that requires a relatively long time to etch compared to theground plane material in the ground plane material etchant. Othermaterials include silicon dioxide (SiO₂).

FIG. 3 shows the addition of a ground plane 22 used for passingelectrical current during electroplating. In this example, a titaniumground plane is used. Alternative materials include titanium-tungsten(TiW) and tungsten (W). The surface is coated with photoresist and asingle photolithographic step then defines the titanium and passivationlayers to form the plating patterns. It should be noted, as will bediscussed further, only one photolithographic process is necessary.

The process then etches the titanium and silicon nitride. This may bedone in a single etch step that patterns both materials, or by using twodifferent etches or removal processes that are selective to the twodifferent materials. As mentioned before, the passivation layer isetch-resistant, meaning that it will etch, but not nearly as quickly asthe ground plane in the preferred ground plane material etchant. Forexample, using a wet hydrogen-fluoride (HF) etch, the titanium etches inapproximately 90 seconds, and the silicon nitride etches for 3 minutesafter the titanium clears. Alternately, a wet HF solution could be usedto etch the titanium and a dry plasma used to etch the SiN.

After etching, the structure has openings 24 and 26, as shown in FIG. 4,over the n-contact and p-contact metal, respectively. The photoresist 28remaining from the photolithography step is left in place for theelectroplating process. As mentioned previously, in current approachesto electroplating, a further masking and etching process, typically withphotolithography, occurs to ensure connection between the ground planeand the electroplating seed layers of the n-contact and p-contactmetals. In the embodiments disclosed here, however, those extraprocesses are eliminated.

At the time the actual electroplating begins, when the ground planereceives the current while in the electroplating bath, the ground planeand the seed layers have no electrical connection. As can be seen inFIG. 4, the passivation layer separates the titanium layer from the seedlayers. When the ground layer receives current in the electroplatingbath, an initial metal bead forms at the accessible portions of theground plane, as shown in FIG. 5.

The initial metal bead 30 begins to grow laterally from the portions ofthe ground plane to which the metal in the electroplating bath haveaccess. The growth may begin in a non-planar fashion, as shown in FIG.5. Very soon after the formation of the initial, lateral bead, however,the bead itself causes an electrical short between the ground plane andthe seed layer, in this example, titanium and gold respectively. Onceshorted, the growth commences from the seed layer surface, as the seedlayer begins to receive current.

FIG. 6 shows the resulting structure with thick metal pads 32 prior tophotoresist removal. In one example, the metal pads form from a seriesof electroplating baths of copper, nickel and gold. Other types ofmetallization could also employ these techniques, such as gold based,indium based, or lead-tin based metallization.

FIG. 7 shows the structure after removal of the photoresist and theground plane. Its is during ground plane removal process that the etchresistant nature of the passivation layer is critical. If the layer'sability to isolate electrical currents is ruined after the removalprocess, then unwanted electrical shorts may occur in the structure.Alternately, the ground plane may be reacted into an electricallyisolating material that does not cause electrical shorting between the pand n contacts. For example by reacting titanium and oxygen to formtitanium dioxide (Ti+O₂->TiO₂). Also, in the current implementations ofelectroplating, referred to above, where a connection exists between theseed layer and the ground plane, the final structure after ground planeremoval would have a structural difference from the structure resultingfrom the processes disclosed here. In order for the connection to bemade between the ground plane and the seed layers, the ground planewould coat the side walls of the passivation layer region. After removalof the ground plane, a small gap would exist between the passivationlayer and the electroplated metal as a result of the removal of theground plane material forming the electrical connection. As can be seenin FIG. 7, the passivation layer and the metal pads 32 have contiguouscontact. This may have structural and electrical benefits for thestructure.

FIG. 8 shows an electroplated structure having thick metal pads beingflip-chip bonded to a bond pad chip. The bond pad chip has a substrate50, with a passivation layer 58 and 59. A wiring layer 52 makes contactwith bond pads 54. Solder, or other material, such as an electricallyconductive paste 56, forms bumps or beads on the bond pads 54.

To mount the electroplated structure, the substrate 10 is flipped overand soldered or otherwise mounted onto the bond pads 54 by the solder56. The structure on substrate 10 still has its passivation layer 20. Inthe example of an LED, the substrate 10 may be transparent or otherwiseallow the passage of light of at least the wavelength emitted by the LEDto allow the ‘upside down’ LED to be usable.

In this manner, the above process provides a simplified method ofelectroplating thick metal pads onto structures that require electricalcontact with other structures. While the examples shown here includeLEDs and other devices suitable for flip-chip bonding, other devices andother mounting processes may be employed.

It will be appreciated that several of the above-disclosed and otherfeatures and functions, or alternatives thereof, may be desirablycombined into many other different systems or applications. Also thatvarious presently unforeseen or unanticipated alternatives,modifications, variations, or improvements therein may be subsequentlymade by those skilled in the art which are also intended to beencompassed by the following claims.

1. A structure, comprising: a substrate; a passivation layer on thesubstrate; and at least one electroplated, metal region on the substratesuch that there is contiguous contact between the metal region and thepassivation layer.
 2. The structure of claim 1, wherein the at least oneelectroplated, metal region comprises two electroplated metal regions,an n-contact region and a p-contact region.
 3. The structure of claim 2,wherein the n-contact region and the p-contact region are a portion alight emitting diode structure.
 4. The structure of claim 1, wherein thesubstrate comprises a sapphire substrate.
 5. The structure of claim 1,wherein the passivation layer is resistant to the ground plane materialetchant.
 6. A device, comprising: a bond pad chip having bond pads;solder beads formed on the bond pads; a component connected to the bondpads by the solder beads, the component comprising: a substrate; apassivation layer on the substrate; and at least one electroplated,metal region on the substrate such that there is contiguous contactbetween the metal region and the passivation layer.
 7. The device ofclaim 6, wherein the component comprises a light emitting diode.